With years, Apple devices have grown thinner and lighter, and they earned a lot of popularity for that. However, its compact feature has had its own share of problems. Only a couple of months back, Apple Inc faced a lot of fury from its fans and others due to the infamous incidence of ‘Bendgate’. Though the devices are becoming close-packed, they are also turning fragile.
However, according to reports online, Apple recently filed a patent titled ‘Encapsulation of a Stiffener Layer in Aluminum’, which explains how Apple plans to add strength to its device’s housing. The tech giant, in the patent application, proposes to embed a stiff material beneath the housing of the iPhones, and overlay that with another sheet of aluminium.
Apple also propounded to deboss a pattern into the aluminium so as to cut the weight of the device. The two innovations put together, Apple plans to make the future iDevices lighter as well as sturdier.
