Rumours of Apple’s next-generation iPhone are already floating around and now a new report suggests that Apple is going to pull a never-before-done trick very soon. Every new iPhone comes with various new features that were never available on previous models and the same is being expected for the next year’s models.
According to MacRumors, popular Analyst Ming-Chi Kuo says that the Cupertino company will reportedly bring new iPhone models in 2018 with dual-SIM support. The next-generation iPhone will feature Intel’s XMM 7560 and Qualcomm’s Snapdragon X20 modems, which will enable faster LTE transmission speeds. Kuo has predicted that Intel will supply Apple with 70 percent to 80 percent of more baseband chips.
“New baseband chips from Intel & Qualcomm will significantly boost transmission speed of new 2H18 iPhone models thanks to supporting 4x4 MIMO antenna design. We believe that 2H18 new iPhones will upgrade baseband chips from Intel’s XMM 7480 and Qualcomm's MDM 9655 in 2H17 to Intel’s XMM 7560 and Qualcomm's SDX 20. As both new chips support 4x4 MIMO technology, compared to only 2x2 MIMO in 2H17, we anticipate LTE transmission speeds will increase significantly," Kuo said.
Kuo has also predicted that next year's iPhone models will feature dual-SIM dual standby (DSDS), with support for LTE+LTE connections, which allows two SIM cards to be active simultaneously using only one set of chips.
As of now, it is not entirely clear if the new iPhones would have a dual SIM card slot or if one of the SIM cards would be embedded into the device.
