Qualcomm's new depth-sensing sensors are focussed towards AR

Qualcomm has unveiled its next generation Spectra Module Program which the company aims to make a part of all mobile devices. The new module is capable of improved biometric authentication and high-resolution depth sensing, which would ensure Qualcomm’s presence in majority of mobile devices and head mounted displays (HMD) for photo and video needs.

The new ISPs and camera modules are engineered to support superior image quality and new computer vision use cases that utilize deep learning techniques and bokeh quality image experiences with a faster time to market for smartphone and HMD devices. The next-generation ISPs feature a new camera architecture designed for advancements in computer vision, image quality and power efficiency for the next Snapdragon mobile and VR platforms. The camera module program additions consist of a trio of camera modules, including an iris authentication module, a passive depth sensing module and an active depth sensing module.

The low-power, high-performance motion tracking capabilities of the Qualcomm Spectra ISP, in addition to optimised simultaneous localisation and mapping (SLAM) algorithms, are designed to support new extended reality (XR) use cases for virtual and augmented reality applications that require SLAM. The Qualcomm Spectra family of ISPs and new Qualcomm Spectra camera modules are expected to be part of the next flagship Snapdragon Mobile Platform.